Tailyn has been well recognized by our worldwide customers as a professional full turnkey service provider. The company provides value added services with manufacturing expertise and quality management at modern facilities.
New Product Introduction (NPI)
Tailyn provides the following services:Manufacturing Engineering - Bill of Material (BOM) - Component Specification and Quality - Machine and Parameters - Production Fixtures and Tooling
Package on Package (PoP)
Package on Package (PoP) assembly is an IC packaging method allowing higher component density in devices such as system on module, mobile phones, PDAs, digital cameras and medical equipment.
In-Circuit Test (ICT)
In-Circuit Test (ICT) systems provide full structural and functional coverage for a wide range of PCBA manufacturing test on high-performance analog, digital, and mixed-signal.
Void Free Soldering
New technology combines a latest generation vapor-phase soldering with classical vacuum-technology.Vapor chamber offering the lowest process temperature, fault free reflow so overheating is physically impossible.Vacuum soldering technology provides void-free soldering.
MFG Executive System (MES)
Tailyn deploys a Real time Manufacturing Executive System (MES) on its shop floors for process monitoring, both shop floor production yield rate status and variant control to prevent all foreseeable faults occurred.