Manufacturing Capability
  • Manufacturing Executive System (MES)
  • Assembly Line
  • Packing Line

SMT Lines

  • Print : DEK
  • Mounter : JUKI
  • Re-flow : Heller
  • 0201 components
  • uBGA
  • CSPs
  • Double sided, mirrored BGA assembly
  • Lead-free assembly
  • RoHS 5/6 assembly
  • PCBA size 50mm * 50mm ~ 530 mm x 360 mm
  • AOI & X-ray Inspection
  • Trial run / Pilot run service and
  • DFM review and report
  • BGA rework and recall capabilities

AOI

  • Type : TR7100EP
 

X-ray

  • Type : Analyzer 160
  • Geometric magnification up to 2060 x
  • X-Y scanning area 610mm*460mm
  • Auto BGA solder-joint evaluation
  • Auto voiding calculation

DIP Lines

  • Wave Solder Type: SELL-400
  • PTH (plated through hole) - up to 600 mm Width
  • Press-fit
  • Lead-free assembly
  • RoHS 5/6 assembly
  • X-ray Inspection
  • Flying Probe Inspection
  • Trial run / Pilot run service and DFM/DFT review and report

MDA

  • Type : TRI-518F
  • HP Test Jet
  • Board view
  • Automatic Guarding points selection

Flying Probe Tester

  • TAKAYA
  • Test speeds of up to .03 seconds per step
  • Repeatability of +/- 50 microns
  • Positioning resolution of 20 microns
  • Minimum pitch of 0.20mm

Burn-in Rooms