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EMS
EMS Services
Manufacturing Capability
Partnership
Manufacturing Capability
Manufacturing Executive System (MES)
In Circuit Tester
Burn-in Room
Auto Optical Inspector
SMT Line
Assembly Line
X-Ray Inspector
DIP Line
Packing Line
SMT Lines
Print : DEK
Mounter : JUKI
Re-flow : Heller
0201 components
uBGA
CSPs
Double sided, mirrored BGA assembly
Lead-free assembly
RoHS 5/6 assembly
PCBA size 50mm * 50mm ~ 530 mm x 360 mm
AOI & X-ray Inspection
Trial run / Pilot run service and
DFM review and report
BGA rework and recall capabilities
AOI
Type : TR7100EP
X-ray
Type : Analyzer 160
Geometric magnification up to 2060 x
X-Y scanning area 610mm*460mm
Auto BGA solder-joint evaluation
Auto voiding calculation
DIP Lines
Wave Solder Type: SELL-400
PTH (plated through hole) - up to 600 mm Width
Press-fit
Lead-free assembly
RoHS 5/6 assembly
X-ray Inspection
Flying Probe Inspection
Trial run / Pilot run service and DFM/DFT review and report
MDA
Type : TRI-518F
HP Test Jet
Board view
Automatic Guarding points selection
Flying Probe Tester
TAKAYA
Test speeds of up to .03 seconds per step
Repeatability of +/- 50 microns
Positioning resolution of 20 microns
Minimum pitch of 0.20mm
Burn-in Rooms